Projects
Case Study - AML Silocon Wafer Bonding System
Brief
Update a silicon wafar bonding system to allow a greater current draw without tripping out the system.
Challenges
Austin Consultants were brought in to analyse an existing system and see if there was a way they could modify the existing code and re-architect it to allow the creation of a customized PID loop, which would allow the system to run at a higher power rating so that the bonding process would be able to be completed at a faster speed.
Solution
Austin Consultants provided a customized PID loop so that the system could allow the ramping up of the power at a steady voltage without the current draw exceeding the recommended levels for the wafer bonding process.
